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iC Stencils Mechanic (UFO) For All Mobile Phones And Computer iC Reballing Universal (15 in 1) (WHITE)

380.00 Rs. 380.00 Rs.

380.00 Rs. / Units
Terms and Conditions
30-day money-back guarantee
Shipping: 2-3 Business Days

Product Description

The iC Stencils Mechanic UFO Universal 15 in 1 is an IC reballing tool designed for mobile phone motherboard repair, computer circuit maintenance, and BGA chip reballing applications. It provides multiple stencil patterns to assist technicians in restoring solder ball connections on compatible integrated circuits.

The Mechanic UFO IC Reballing Stencil features an arrangement of precision-patterned openings that help position solder paste over the contact points of BGA chips. These patterns support accurate solder ball formation during chip reballing procedures.

Designed for multipurpose IC repair, the stencil includes different grid arrangements and opening sizes for working with various chip layouts. Its patterned sections make it useful for technicians handling different types of electronic components during motherboard maintenance.

The stencil features a thin metal sheet construction with a silver-white appearance, providing a flat surface for applying solder paste. Its compact rectangular design makes it convenient to position during reballing work and store alongside other microsoldering equipment.

The Mechanic UFO Universal 15 in 1 IC Stencil is suitable for mobile phone repair technicians, computer motherboard servicing, and electronic chip maintenance. Available at HT PRIME, it provides a practical solution for preparing compatible BGA chips for solder reballing.

Key Features

  • Brand: Mechanic electronic repair tools.

  • Model: UFO.

  • Product Type: Universal IC reballing stencil.

  • Stencil Configuration: 15 in 1.

  • Color: White.

  • Precision Openings: Designed to support accurate solder paste positioning.

  • Multiple Grid Patterns: Provides different layouts for compatible IC reballing tasks.

  • Metal Sheet Construction: Thin stencil design for detailed soldering applications.

  • BGA Reballing: Helps prepare solder ball connections on electronic chips.

  • Applications: Suitable for compatible mobile phone ICs, computer chips, and motherboard reballing work.

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Frequently asked questions

You can reach our customer support team through the following channels:

Our team is available to assist with product inquiries, wholesale orders, order tracking, and technical support.

Yes. HT Prime offers competitive wholesale pricing for mobile repair shops, retailers, wholesalers, and distributors. Contact our sales team for bulk order inquiries and customized pricing.

Yes. We provide fast and reliable nationwide delivery across Pakistan. Delivery times may vary depending on your location and the courier service.

If you receive a damaged, defective, or incorrect product, please contact our customer support team as soon as possible. Eligible products can be returned or replaced according to our return policy. Please ensure the product is in its original condition and contact us before returning any item.

HT Prime is a trusted supplier of Mobile Phone Parts and Mobile Spare Parts in Pakistan. We offer high-quality replacement parts for major smartphone brands, competitive wholesale prices, fast nationwide delivery, and dedicated customer support for repair shops, retailers, and individual customers.