Product Description
The 2UUL Find 210 FD40 Chip Heating Glue Removal Station is a professional mobile phone repair tool designed to assist technicians with controlled heating, adhesive softening, and glue removal during delicate IC chip and motherboard maintenance. Its compact structure makes it a practical accessory for advanced smartphone repair workshops.
Designed for a 150–200°C operating temperature range, the 2UUL Find 210 FD40 supports heating applications where controlled temperatures are required to soften adhesive around electronic components. This helps technicians perform detailed chip maintenance and glue removal procedures with greater precision.
The 2UUL FD40 Chip Heating Glue Removal Tool features a slim metal heating probe and a compact holding structure. Its adjustable fastening mechanism helps technicians position suitable components securely while performing delicate repair operations.
Its lightweight design and practical construction make it convenient for professional workstations. The narrow metal probe provides access to selected small working areas, supporting controlled adhesive removal and detailed electronic servicing.
Available at HT PRIME, the 2UUL Find 210 FD40 is a useful tool for technicians seeking convenient chip heating, precise glue removal, and improved handling during professional mobile phone motherboard repairs.
Key Features
• Model: 2UUL Find 210 FD40 Chip Heating Glue Removal Station.
• Temperature Range (150–200°C): Designed for controlled heating applications within the specified temperature range to assist with adhesive softening and chip maintenance.
• High-Temperature Glue Removal: Supports the softening and removal of suitable adhesives around electronic components during precision motherboard repairs.
• Precision Metal Heating Probe: Features a slim metal probe designed to provide access to small working areas during detailed chip servicing.
• Adjustable Fastening Mechanism: Equipped with a convenient adjustment knob that helps secure the tool's working components during repair procedures.
• IC Chip Maintenance: Suitable for controlled heating and adhesive removal tasks involving appropriate electronic chips and motherboard components.
• Compact Working Structure: Features a space-saving design that allows convenient positioning on professional mobile phone repair workbenches.
• Convenient Component Handling: Helps technicians maintain better control while working with delicate chips and electronic components.
• Durable Construction: Features a metal probe and sturdy supporting structure designed for regular use in professional repair environments.
• Professional Motherboard Repair: Useful for chip glue removal, IC maintenance, adhesive softening, and detailed smartphone motherboard servicing.
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Frequently asked questions
You can reach our customer support team through the following channels:
- Phone: +92 308 6564000 / +92 303 6564000
- Email: htprimeofficial@gmail.com
- Website: https://htprime.pk
Our team is available to assist with product inquiries, wholesale orders, order tracking, and technical support.
Yes. HT Prime offers competitive wholesale pricing for mobile repair shops, retailers, wholesalers, and distributors. Contact our sales team for bulk order inquiries and customized pricing.
Yes. We provide fast and reliable nationwide delivery across Pakistan. Delivery times may vary depending on your location and the courier service.
If you receive a damaged, defective, or incorrect product, please contact our customer support team as soon as possible. Eligible products can be returned or replaced according to our return policy. Please ensure the product is in its original condition and contact us before returning any item.
HT Prime is a trusted supplier of Mobile Phone Parts and Mobile Spare Parts in Pakistan. We offer high-quality replacement parts for major smartphone brands, competitive wholesale prices, fast nationwide delivery, and dedicated customer support for repair shops, retailers, and individual customers.